The global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.

Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in the market is growth of advanced system in package (SiP) modules. A system in a package refers to the technology that enables the integration of several integrated circuits (ICs) within a single package. These packages combine many of the functions performed by different ICs into a single module, which can perform all these operations single-handedly.

According to the report, one driver in the market is growth of cloud-based servers and big data services. Cloud computing is an Internet-based computing technology that allows devices with limited processing or storage capabilities to store and process data and resources on remote servers; the processed information is delivered back to the original device in real time. With the information collected by various devices becoming increasingly large and complex, the demand for cloud computing applications is growing exponentially.

Key vendors

  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)

Other prominent vendors

  • Chipbond Technology
  • ChipMOS TECHNOLOGIES
  • FormFactor
  • Formosa Advanced Technologies
  • King Yuan ELECTRONICS
  • Lingsen Precision Industries
  • PSi Technologies
  • SIGNETICS
  • Tessolve Semiconductor
  • Tianshui Huatian Technology
  • Unisem
  • UTAC

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

PART 05: Market landscape

  • Market size and forecast
  • Five forces analysis

PART 06: Market segmentation by service

  • Assembly services
  • Testing services

PART 07: Geographical segmentation

  • Semiconductor assembly and testing services market in APAC
  • Semiconductor assembly and testing services market in Americas
  • Semiconductor assembly and testing services market in EMEA

PART 08: Decision framework

PART 09: Drivers and challenges

PART 10: Market trends

  • Growth of advanced system in package (SiP) modules
  • Increasing focus of semiconductor suppliers on core competencies
  • Growing demand for FOWLP solutions

PART 11: Vendor landscape

  • Competitive scenario
  • Other prominent vendors

PART 12: Key vendor analysis

  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)

PART 13: Appendix

For more information about this report visit https://www.researchandmarkets.com/research/xxps3w/global

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