The SMIC 55nm ULP+RF+eFlash technology platform is focused for use on ultra-low-power IoT applications. The process and performance improvements are based on the stable 55nm logic and mix-signal technologies. The nominal operating voltage can be lowered 30%, and the device will reduce 45% of dynamic power consumption, and 70% of static power consumption, as well as lowering the SRAM leakage. Furthermore, the platform is compatible with RF and eFlash technologies and has complete IP solutions. Compared with other technology nodes, SMIC 55nm ULP+RF+eFlash technology is a reliable platform for low power IoT SoC design; it can meet the strict requirements of NB-IoT for low stand-by power consumption and small package size.
Based on SMIC’s complete 55nm ultra low power technology platform and Sanechips’ powerful design capabilities, the NB-IoT SoC RoseFinch7100 is specially designed for extensive low power IoT applications. Its sleep power is 2uA which accounts for 16% of its total power consumption while sending and receiving message once per day. In addition, RoseFinch7100 uses single chip design with minimum peripherals and supports R14 full band with integrated cloud-chip security performance as well as open application architecture.
“I am very glad to work closely with Sanechips to promote the design, manufacturing and commercialization of NB-IoT chips in Mainland China. This achievement fills the gap in the China market and conforms to SMIC’s consistent IoT technology development strategy as well,” said Mr. Mike Rekuc, Executive Vice President of Worldwide Sales & Marketing, SMIC. “By integrating ULP, RF and embedded flash technologies, SMIC’s 55nm platform is highly suitable for NB-IoT and other IoT chip products and can meet customers’ demands for power and performance.”
“SMIC’s strong manufacturing capabilities effectively guaranteed the commercialization of Sanechips’ new generation of NB-IoT chip, RoseFinch7100, on time. According to the test results, the chip’s function and performance all met the expected requirements and achieved leading industry benchmarks in several core indicators of IoT related applications, including sleep power consumption, cut-off voltage, and peripheral interface quantity, with the obvious advantages of low cost and low power consumption,” said Mr. Long Zhijun, Vice President of Sanechips. “The chip will further revolutionize the IoT industry. Other NB-IoT commercial products will meanwhile be launched by collaborating with several partners. This world-leading chip is catching up to the launch schedules of China’s big three telecomm operators and can help customers seize the best time to enter the market.”
Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.
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This press release contains, in addition to historical information, “forward-looking statements” within the meaning of the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on SMIC’s current assumptions, expectations and projections about future events. SMIC uses words like “believe,” “anticipate,” “intend,” “estimate,” “expect,” “project,” “target” and similar expressions to identify forward looking statements, although not all forward-looking statements contain these words. These forward-looking statements are necessarily estimates reflecting the best judgment of SMIC’s senior management and involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC’s actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with cyclicality and market conditions in the semiconductor industry, intense competition in the semiconductor industry, SMIC’s reliance on a small number of customers, timely wafer acceptance by SMIC’s customers, timely introduction of new technologies, SMIC’s ability to ramp new products into volume, supply and demand for semiconductor foundry services, industry overcapacity, shortages in equipment, components and raw materials, availability of manufacturing capacity, financial stability in end markets, orders or judgments from pending litigation, intensive intellectual property litigation in semiconductor industry, general economic conditions and fluctuations in currency exchange rates.
In addition to the information contained in this press release, you should also consider the information contained in our other filings with the SEC, including our annual report on Form 20-F filed with the SEC on April 27, 2017, especially in the “Risk Factors” section and such other documents that we may file with the SEC or The Hong Kong Stock Exchange Limited (“SEHK”) from time to time, including current reports on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on our future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated or, if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.
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About Sanechips Technology Co., Ltd.
Sanechips Technology Co., Ltd. Is the new name of Shenzhen ZTE Microelectronics Technology Co., Ltd. is established in 1996, has 20 years R&D experience with 3000 patents(top1 of China in 2016), and more than 2000 employees located at 9 R&D centers globally in China, Canada & USA. As a Communication Chipset focused IC company, Sanechips has a full roadmap for Cloud/Channel/Device, its total sale revenue is over 0.82B$ (5.6 billion RMB, top3 of China in 2016). Based on WiseFone 4G chipset, multiple MBB, M2M & creative devices have been shipped to China & 30 overseas countries in 2016. Strategically, Sanechips pays close attention to NB-IoT & 5G chipsets that it believes can generate tens of millions of shipments and help Sanechips become the world’s leading Communication IC Company in the future.
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SOURCE Semiconductor Manufacturing International Corporation
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